PREFACE A NOTE TO INSTRUCTORS ABOUT THE AUTHOR NOTATIONAL CONVENTIONS Chapter 1 Introduction 1.0 Preview 1.1 The History of MEMS Development 1.2 The Intrinsic Characteristics of MEMS 1.2.1 Miniaturization 1.2.2 Microelectronics Integration 1.2.3 Mass Fabrication with Precision 1.3 Devices: Sensors and Actuators 1.3.1 Energy Domains and Transducers 1.3.2 Sensors 1.3.3 Actuators Summary Problems References Chapter 2 Introduction to Microfabrication 2.0 Preview 2.1 Overview of Microfabrication 2.2 The Microelectronics Fabrication Process 2.3 Silicon-Based MEMS Processes 2.4 New Materials and Fabrication Processes 2.5 Points of Consideration for Processing Summary Problems References Chapter 3 Review of Essential Electrical and Mechanical Concepts 3.0 Preview 3.1 Conductivity of Semiconductors 3.1.1 Semiconductor Materials 3.1.2 Calculation of Charge Carrier Concentration 3.1.3 Conductivity and Resistivity 3.2 Crystal Planes and Orientation 3.3 Stress and Strain 3.3.1 Internal Force Analysis: Newton's Laws of Motion 3.3.2 Definitions of Stress and Strain 3.3.3 General Scalar Relation Between Tensile Stress and Strain 3.3.4 Mechanical Properties of Silicon and Related Thin Films 3.3.5 General Stress-Strain Relations 3.4 Flexural Beam Bending Analysis Under Simple Loading Conditions 3.4.1 Types of Beams 3.4.2 Longitudinal Strain Under Pure Bending 3.4.3 Deflection of Beams 3.4.4 Finding the Spring Constants 3.5 Torsional Deflections 3.6 Intrinsic Stress 3.7 Resonant Frequency and Quality Factor 3.8 Active Tuning of the Spring Constant and Resonant Frequency 3.9 A List of Suggested Courses and Books Summary Problems References Chapter 4 Electrostatic Sensing and Actuation 4.0 Preview 103 4.1 Introduction to Electrostatic Sensors and Actuators 4.2 Parallel-Plate Capacitors 4.2.1 Capacitance of Parallel Plates 4.2.2 Equilibrium Position of Electrostatic Actuator Under Bias 4.2.3 Pull-In Effect of Parallel-Plate Actuators 4.3 Applications of Parallel-Plate Capacitors 4.3.1 Inertia Sensor 4.3.2 Pressure Sensor 4.3.3 Flow Sensor 4.3.4 Tactile Sensor 4.3.5 Parallel-Plate Actuators 4.4 Interdigitated Finger Capacitors 4.5 Applications of Comb-Drive Devices 4.5.1 Inertia Sensors 4.5.2 Actuators Summary Problems References Chapter 5 Thermal Sensing and Actuation Chapter 6 Piezoresistive Sensors Chapter 7 Piexoelectric Sensing and Actuation Chapter 8 Magnetic Actuation Chapter 9 Summary of Sensing and Actuation Chapter 10 Bulk Micromachining and Silicon Anisotropic Etching Chapter 11 Surface Micromachining Chapter 12 Polymer MEMS Chapter 13 Microfluidics Applications Chapter 14 Instruments for Scanning Probe Microscopy Chapter 15 Optical MEMS Chapter 16 MEMS Technology Management Appendix A Material Properties Appendix B Frequently Used Formulas for Beams and Membranes Index