本书系统介绍了超摩尔时代先进封装理论模型、分析与新的模拟结果。内容涉及2.5D、3D、晶圆级封装的电性能、热性能、热机械性能、散热问题、可靠性问题、电气串扰等问题，提出了基于多孔介质体积平均理论的建模方法并应用于日渐复杂的先进封装结构，以及模型验证、设计和测试，并从原理到应用对封装热传输进行了很好的介绍。同时，引入并分析了碳纳米管、金刚石镀层、石墨烯等新材料的应用性能。本书针对产品开发阶段封装的热管理和应力管理方面进行了详细阐述，在封装性能测试、蒸汽层散热器、微槽道冷却、热电制冷等方面也有涉及。相应的试验测试和案例分析也便于读者提高对封装性能表征和评估方法的理解。 本书可作为从事微电子封装行业人员的参考资料，也可供高等院校相关专业研究生和高年级本科生学习参考。

Preface vii Acknowledgments xi About the authors xiii 1Introduction 1 1.1Evolution of integrated circuit packaging 1 1.2Performance and design methodology for integrated circuit packaging 6 References 11 Further reading 12 2Electrical modeling and design 13 2.1Fundamental theory13 2.2Modeling, characterization, and design of through-silicon via packages 28 References 53 3Thermal modeling, analysis, and design 59 3.1Principles of thermal analysis and design 59 3.2Package-level thermal analysis and design 74 3.3Numerical modeling 89 3.4Package-level thermal enhancement 97 3.**ir cooling for electronic devices with vapor chamber configurations 101 3.6Liquid cooling for electronic devices 106 3.7Thermoelectric cooling 112 References 126 4Stress and reliability analysis for interconnects 131 4.1Fundamental of mechanical properties 131 4.2Reliability test and analysis methods 149 4.3Case study of design-for-reliability 227 References 239 5Reliability and failure analysis of encapsulated packages 245 5.1Typical integrated circuit packaging failure modes 245 5.2Heat transfer and moisture diffusion in plastics integrated circuit packages 245 5.3Thermal- and moisture-induced stress analysis 263 5.4Fracture mechanics analysis in integrated circuits package 270 5.5Reliability enhancement in PBGA package 282 References 290 Further reading 292 6Thermal and mechanical tests for packages and materials 293 6.1Package them叫tests 293 6.2Material mechanical test and characterization 306 References 322 7System-level modeling, analysis, and design 325 7.1System-level them叫modeling and design 325 7.2Mechanical modeling and design for microcooler system 348 7.3Codesign modeling and analysis for advanced packages 370 References 389 Appendix 1 Nomenclature 393 Appendix 2 Conversion factors 403 Index 405